Using its WaferOptics® production technology, Anteryon produces lens modules on wafer scale. Arrays of complete fully focused lens modules are sent to subcontractors for bonding to a light sensor such as a CMOS wafer to form a camera module.

Anteryon’s lens modules include filters and diaphragms and up to 8 optically active surfaces to form mega pixel cameras.

Losse Lensstacks

The total package is compact, ready for integration to a full imaging sensor package without additional assembly steps.

An additional bottom spacer aligns the camera lens in vertical direction eliminating the need for focussing.

Anteryon’s WaferOptics® camera objectives are robust and reliable to levels suitable for arduous environment applications. Our camera modules are reflow solderable and SMA and Telcordia compliant.

The WaferOptics® technology is expected to dominate the camera modules lens system market in the near future.

The scalability of our processes allows us to ramp production quickly for high volume applications such as mobile handsets. Lens wafers are made on glass substrates carrying large arrays of lenses which are formed by the Anteryon’s replication technology. In between the wafers Anteryon places in-house powder blasted glass substrates which are used as spacers.

The wafers are then stacked in a multilayer package to form a complete fully focused optical assembly ready for bonding to a light sensor such as a CMOS wafer or a light source such as a VCSEL wafer.

Options:

  • lens replication on both sides of a single wafer
  • stacked wafers to create high end solutions with up to 8 optically active surfaces
  • integrating of filters
  • integration of diaphragms
  • spacer layers
  • interface mounting face layer to the light sensor / source
stacked-waters

The total package is compact, ready for integration to a full imaging sensor package without additional assembly steps.
An additional bottom spacer aligns the lens (array) in vertical direction eliminating the need for focussing.
Our WaferOptics® camera objectives are robust and reliable to levels suitable for arduous environment applications. Our camera modules are reflow solderable and SMA and Telcordia compliant.
The WaferOptics® technology is expected to dominate the camera modules lens system market in the near future.

Wafer scale manufacturing process enables the production of a large volume of optical elements on a single glass wafer. These micro optical elements can be refractive such as (a)spherical, (a)cylindrical or free-form lenses or diffractive optical elements so called DOE’s.

Replication on glass wafers increases temperature stability and enables reflow soldering.

109052-165 collage

Design flexibility can be increased by using both sides of the glass wafer.
Costs of for example VCSEL lasers or CMOS image sensors might be reduced even further by eliminating the glass plate by replicating the optical elements directly on top of electro optical wafers.

Reflowabililty enables customers to automatically mount and solder the camera or laser in batch process to the printed circuit board. The cost advantage is enormous by reduction of labour costs and process time.

WaferOptics® naturally follows the semiconductor roadmap. Smaller pixel sizes, smaller dimensions enable lower cost per sensor or laser. Smaller sensor or laser sizes require smaller optics, thereby allowing more lenses per optical wafer, and thus lower cost per lens.

Please ask Anteryon to help you converting your current design to a WaferOptics® solution.

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